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DYCOstrate . A different approach to small via creation has been taken by Dyconex AG of Switzerland. After ground and power patterns are formed on the panel, and the panel is oxide-treated, polyimide-backed copper foil is laminated on the panel. Holes in the copper are formed by a chemical etching process, and the insulating polyimide material underneath the holes is removed by plasma etching. PWBs made in such a way are called DYCOstrate. In other, similar technologies, different dielectric materials are used, and they are removed by alkaline solutions.The rest of the process is similar to that for SLC; that is, holes are metallized and a thick copper deposition is made by electroless or galvanic plating, and the circuit pattern is formed by a tent-and-etch process (see Fig. 5.5). Drilled Vias. In both SLC and DYCOstrate cases, through-holes can also be made by conventional drilling and plating processes, in addition to the surface blind via holes. Cost Impact. The manufacturing cost of these sequential technologies is not necessarily directly cheaper than conventional MLB technology, which depends on a laminating press operation. However, since the cost of making standard holes in a board can be as high as 30 percent of the total manufacturing cost, and the creation of holes in these processes is comparatively inexpensive, the overall cost for equivalent functionality can be less. In addition, the fine pattern capability for this process is excellent. For example, an eight-layer conventional structure can often be reduced to a four-layer structure, reducing the total cost for the same packaging density.

For low-cost applications, a ceramic resonator is an attractive proposition. Ceramic resonators are three terminal components with the resonant components in a single package as illustrated in Figure 5.5. Figure 5.6 illustrates how a ceramic resonator can be connected to the oscillator pins of the AVR processor. No other component is required for the oscillator. The advantages of a ceramic resonator are:

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performance attributes are determined for a given machine, they must be integrated to predict the performance of the entire assembly line. For example, it is preferred that the throughputs of the individual machines be matched for the product application. A mismatch of machine capabilities can generate bottlenecks in the assembly process. The slowest machine or function then controls the production rate of the entire line. The obvious consequence of a bottleneck is an underutilization of the other equipment, which ultimately appears as an increase in manufacturing costs. But there are also quality control reasons to smooth out the flow of bottlenecked assembly processes. For example, if the component placement machine has a throughput of 100 circuit boards per hour, but the reflow machine can only process 90 circuit boards per hour, then printed and stuffed boards will spend time in the open factory air awaiting entry into the reflow step. The consequence is a degradation of paste properties, resulting in the increased likelihood of solderability defects and a drop in product yield. Such technical ramifications must also be addressed when considering equipment utilization for an assembly process.

The friction force is mainly due to the shearing of the fluid film The force is proportional to the viscosity, relative sliding speed, land area and inversely proportional to the clearance: v 2 2 ( a + b ) c 4c2 + 08584r(int) FL = h FL =

Costs There are several cost factors to consider when establishing an assembly line: the initial capital investment for the machine(s); depreciation and lifetime (obsolescence) of that equipment; operational costs such as labor rates, electricity, water, or the use of inert atmospheres; and maintenance support costs Many of these cost factors are determined on a per product unit basis so that an estimate of potential production volumes is often required for their calculations Many OEMs and CMS providers have had to establish their own cost models to take into account labor rates, energy costs, shipping costs, and tax structures that are specific to the assembly plant location on-shore as well as overseas Because of the cost variables just mentioned, it is difficult to establish a universal model for these calculations When addressing the implementation of Pb-free soldering technology, one must consider two aspects regarding equipment costs.

First are the direct costs of purchasing and installing equipment that can provide a Pb-free assembly capability Second is the cost of simply developing a Pb-free assembly line in the factory Regarding the first point, equipment capability vis- -vis Pb-free solder pertains primarily to the soldering process, including the reflow furnace, wave-soldering machine, soldering irons, etc Printing and placement equipment is largely unaffected by the Pb-free soldering technology Most reflow equipment used for Sn-Pb soldering is nominally capable of also supporting Pb-free soldering for moderately complex circuit boards Changes are simply made to the time-temperature profile of a reflow furnace On the other hand, for more highly complex products, a replacement reflow furnace may be required that has more than the typical five to seven zones A larger number of zones allows more flexibility and greater control over the time-temperature profile.

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