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The available Sn-Pb process window is 215 C to 260 C, or a T equal to 45 C, rather than the T of 30 C for the Sn-Ag-Cu Pb-free solders (Tmelt = 217 C) The important consequence of the smaller process window is that, as the mix of components increases on the circuit board, the likelihood increases that the solder joints on some of the larger components will not reach the minimum 230 C required for good solderability when the maximum circuit board temperature is required to be less than 260 C Similar process window scenarios can be evaluated for wave soldering and manual processes For example, in the latter case of manual soldering, the operator is unable to use the same soldering tip or iron to assemble all of the components.

On the other hand, a soldering iron that is found to be effective for soldering large components may be too hot and/or too large for smaller devices, causing thermal and/or physical damage, respectively, to them The second premise of process control is the repeatability of making an acceptable solder joint on each assembled circuit board With the exception of a major equipment failure that alters the time-temperature profile, the capability to solder the same joint repeatedly in an acceptable manner is more a function of the consistent solderability of the material set s properties Those solderability properties include the efficacy of the flux, the properties of the solder metal (eg, surface oxidation and particular to the case of solder paste, the solder powder particle size, and metal loading), and the solderability of the component I/O and associated circuit board feature.

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Moreover, the solderability of component I/Os and circuit board features is often identified as the primary factor in repeatedly making acceptable interconnections Unfortunately, because poor solderability is often the leading cause of poor reproducibility of acceptable solder joints, this does not bode well for Pb-free solders Intrinsically, the Pbfree solders generally show poorer solderability than the eutectic Sn-Pb composition..

Therefore, to minimize assembly (solderability) defects, process engineers must be particularly vigilant to ensure that the surfaces of component I/Os and circuit board pads have optimum solderability.

The pressure distribution over the area of the pocket is nearly constant, but the pressure subsequently drops towards the outer perimeter of the land Therefore, the equivalent area is imagined as an area that is subjected to the same pressure as that of the liquid in the recess that would develop the same thrust as the actual hydrostatic pad

Cleaning The use of no-clean and low-solids fluxes has reduced the need to clean a greater number of circuit boards. Nevertheless, high-reliability electronics, as well as those used in harsh environments, may still require the removal of flux residues. The primary metric used to control the cleaning process is the quantity of residues that remain on the circuit board or components. Visual inspection (white light or ultraviolet light) and ionic testing are the two most commonly used methods to assess a cleaning step. In addition, in-circuit testing (ICT) provides a secondary means to indicate excessive residus presence. The residues prevent the electrical probe from reaching the conductor, which is registered as an open in the data collection routine. Unexpectedly large numbers of open defects may indicate excessive flux residues on the circuit boards as well as signify an actual electrical performance defect. Also, in the case of high-frequency circuit boards (radio frequency and microwave), ICT can identify flux residues as indicated by signal leakage and other parasitics when inspecting for electrical performance. The cleaning step must be carefully considered for a Pb-free soldering process. The higher processing temperatures can increase the tenacity of residues, particularly those of fluxes designed for Sn-Pb processes. This point addresses fluxes used separately, as in manual or wave soldering, as well as the flux in solder pastes. The cleaning step may need to be enhanced to ensure that these residues are removed satisfactorily from the circuit board surface. On the other hand, flux formulations that have been developed specifically for the Pb-free soldering processes may create residues that are not compatible with cleaning processed developed specifically for Sn-Pb technology.

clock input of the AVR processor, the clock signal is applied to the X1 input pin of the AVR processor. The advantages of using a clock crystal IC are:

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